SCHEMATICS DIAGRAM

Vivo Y91 (1811) Full Dump || Vivo Y91 (1807) Qualcomm Full Dump 100% Tested Dump

Vivo Y91 (1811) Full Dump || Vivo Y91 (1807) Qualcomm Full Dump 100% Tested Dump

Init bus…
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) – High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x03, serial number: 0x0A29EC1E
Manufacturing date: Jun 2019
CID: 90014A68 42386150 3E030A29 EC1E66EE
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
Device version: 0x420E
Firmware version: 0x34303030
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 272264]
User area: 29.12 GiB(31,268,536,320 bytes)
ANDROID System Info:
platform: msm8937, cpu abi: arm64-v8a
manufacturer: vivo
board: QC_Reference_Phone, name: msm8937_64
brand: vivo, model: vivo 1807
build id: OPM1.171019.026, version: 8.1.0 [Oreo] (OPM1.171019.026 release-keys)
build description: msm8937_64-user 8.1.0 OPM1.171019.026 eng.compil.20210412.120019 release-keys
crypto state: encrypted?
Preset sets to 6.80 GiB (exclude userdata)
Current partition access:
Access to user area.

Vivo Y91 (1811) ISP Pinout

Vivo Y91 (1811) Full Dump || Vivo Y91 (1807) Qualcomm Full Dump 100% Tested Dump

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